Professional experience and career objectives: Technical leader with extensive experience in technology development and project management in startup and large company environments. Demonstrated proficiency in: Process Development from conception thru implementation, Management of cross-functional teams, Effective communication with multiple stakeholders, and Technology transfer.
Skills and areas of expertise: Expertise in Microelectronic Packaging, Thermal Management, Energy Technologies, Etching, Plating, Joining Technologies, Materials Characterization, Failure Analysis, and Corrosion Prevention. An innovator and problem solver with 44 issued US Patents and 80+ publications. Research award recepient.
Current Employment
Chief Scientist /Chief Engineer
Cooligy, Emerson Network Power
(Electronics, Electricity) - United States
november 2003 - Today (6 years)
Providing technical leadership on various aspects of materials and process development efforts to develop and manufacture precision cooling solutions for advanced microelectronic & photonic products.
Former Employment
Group Leader/Manager, Passivation/C4/Assembly
Intel Corporation, Hillbosro, OR
(Electronics, Electricity) - United States
august 1999 - october 2003 (4 years 2 months)
Led development activities in Chip Interconnect Materials and Packaging Technologies. Managed interactions between chip fabrication and packaging sites; developed and implemented new interconnect materials and their processing technologies.
Manager, Flip Chip Interconnect Technologies
IBM Corporation
(Electronics, Electricity) - United States
january 1997 - july 1999 (2 years 6 months)
Conceived, developed, and transferred to IBM manufacturing the electroplated C4 (flip-chip) technology. The plated C4 technology is now an industry standard advanced chip-package interconnection representing multi billion dollar business.
Manager, Micromachining and Energy Technology
IBM Corporation
(Electronics, Electricity) - United States
january 1993 - december 1996 (3 years 11 months)
Developed thin foil-type, flexible primary battery for smart cards and RF-ID tags. Chaired NEMI's TWG/TIG, developed strategic directions and technology roadmap of energy storage systems for portable electronic products
Research Staff Member & Project Leader
IBM Corporation
(Electronics, Electricity) - United States
november 1985 - december 1993 (8 years 1 month)
Conducted R&D activities in processing technologies for microelectronic packaging. Developed expertise in different aspects of microfabrication including etching, polishing and plating
Education
Ecole polytechnique fédérale de Lausanne Switzerland
, march 1973 - september 1975
Doctorate in Technical Sciences, Electrochemical Materials Engineering
University of California, Los Angeles United States (California)
, january 1969 - december 1970
M.S. Engineering, Energy & Kinetics
Harcourt Butler Technological Institute, Kanpur India
, june 1964 - june 1968
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